Handbook of 3D Integration - Vol. 4: Design, Test and Thermal Management, Franzon
Автор: Ishida, Hatsuo Название: Handbook of Benzoxazine Resins ISBN: 044463844X ISBN-13(EAN): 9780444638441 Издательство: Elsevier Science Рейтинг: Цена: 37897.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This handbook provides a wide overview of the field, fundamental understanding of the synthetic methods and structure/property correlation, as well as studies related to applications in a wide range of subjects. The handbook also provides 1H and 13C NMR spectra, FTIR spectra, DSC and TGA thermograms to aid in research activities. Additional tables on key NMR and FTIR frequencies unique to benzoxazine, heat of polymerization, Tg, and char yield will greatly aid in thechoice of proper benzoxazine for aspecific application.
Описание: This up-to-date reference is the most comprehensive summary of the field of nanoscience and its applications. It begins with fundamental properties at the nanoscale and then goes well beyond into the practical aspects of the design, synthesis, and use of nanomaterials in various industries.
Автор: Francisco da Silva; Teresa McLaurin; Tom Waayers Название: The Core Test Wrapper Handbook ISBN: 148998769X ISBN-13(EAN): 9781489987693 Издательство: Springer Рейтинг: Цена: 18237.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The Core Test Wrapper Handbook: Rationale and Application of IEEE Std. This book focuses on practical design considerations inherent to the application of IEEE Std. The authors provide background information about some of the choices and decisions made throughout the design of IEEE Std.
Автор: Garrou Philip Название: Handbook of 3d Integration V1 and 2 ISBN: 3527332650 ISBN-13(EAN): 9783527332656 Издательство: Wiley Рейтинг: Цена: 23118.00 р. Наличие на складе: Поставка под заказ.
Описание: With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.
Автор: Garrou P Название: Handbook of 3D Integration V 3 ISBN: 3527334661 ISBN-13(EAN): 9783527334667 Издательство: Wiley Рейтинг: Цена: 22643.00 р. Наличие на складе: Поставка под заказ.
Описание: Edited by key figures in the field and written by top authors from academia and industry, this book covers the intricate details of 3D process technology from both a technological and a materials science perspective.
This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications.
Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems;
Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems;
Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.
Introduction to Network-on-Chip Designs and Tests.- Iterative Mapping with Through Silicon Via (TSV) placement for 3D-NoC-based multicore systems.- A constructive Heuristic for integrated mapping and TSV Placement for 3D-NoC-based multicore systems.- Discrete Particle Swarm Optimization for integrated mapping and TSV Placement for 3D-NoC-based multicore systems.- Temperature-aware application mapping strategy for 2D-NoC-based multicore systems.- Temperature-aware design strategy for 3D-NoC-based multicore systems.- Temperature-aware test strategy for 2D as well as 3D-NoC-based multicore systems.
Автор: Boulos Название: Handbook of Thermal Plasmas ISBN: 3030849341 ISBN-13(EAN): 9783030849344 Издательство: Springer Рейтинг: Цена: 134164.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This authoritative reference presents a comprehensive review of the evolution of plasma science and technology fundamentals over the past five decades.
Автор: Gur, Cemil Hakan Название: Handbook of Thermal Process Modeling Steels ISBN: 0849350190 ISBN-13(EAN): 9780849350191 Издательство: Taylor&Francis Рейтинг: Цена: 39046.00 р. Наличие на складе: Нет в наличии.
Описание: Optoelectronic devices utilize semiconductor structures that enable the interaction and propagation of electrons and photons, and are the foundation of a huge range of devices. This handbook provides an overview of modeling and simulation for optoelectronic device design, analysis, and performance optimization.
Автор: Li Zhong, Halang Wolfgang A., Chen Guanrong Название: Integration of Fuzzy Logic and Chaos Theory ISBN: 3540268995 ISBN-13(EAN): 9783540268994 Издательство: Springer Рейтинг: Цена: 26216.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book attempts to present some current research progress and results on the interplay of fuzzy logic and chaos theory. More specifically, this book includes a collections of some state-of-the-art surveys, tutorials, and application examples written by some experts working in the interdisciplinary fields overlapping fuzzy logic and chaos theory. The content of the book covers fuzzy definition of chaos, fuzzy modeling and control of chaotic systems using both Mamdani and Takagi-Sugeno models, fuzzy model identification using genetic algorithms and neural network schemes, bifurcation phenomena and self-referencing in fuzzy systems, complex fuzzy systems and their collective behaviours, as well as some applications of combining fuzzy logic and chaotic dynamics, such as fuzzy-chaos hybrid controllers for nonlinear dynamic systems, and fuzzy-model-based chaotic cryptosystems. This book can serve as a handy reference for researchers working in the interdisciplines related, among others, to both fuzzy logic and chaos theory.
Автор: Kazuo Kondo; Morihiro Kada; Kenji Takahashi Название: Three-Dimensional Integration of Semiconductors ISBN: 3319186744 ISBN-13(EAN): 9783319186740 Издательство: Springer Рейтинг: Цена: 18237.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.
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