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Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices, Ulrich Hilleringmann


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Автор: Ulrich Hilleringmann
Название:  Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
ISBN: 9783658410407
Издательство: Springer
Классификация:


ISBN-10: 365841040X
Обложка/Формат: Paperback
Страницы: 264
Вес: 0.56 кг.
Дата издания: 03.08.2023
Язык: English
Издание: 1st ed. 2023
Иллюстрации: 2 illustrations, color; 176 illustrations, black and white; xi, 264 p. 178 illus., 2 illus. in color.
Размер: 240 x 168
Подзаголовок: Processing and integration of microelectronic devices
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.
Дополнительное описание: Wafer fabrication.- Thermal oxidation.- Lithography.- Etching technology.- Doping techniques.- Chemical and Physical Deposition.- Metallization and Contacts.



3D Microelectronic Packaging: From Architectures to Applications

Автор: Li Yan, Goyal Deepak
Название: 3D Microelectronic Packaging: From Architectures to Applications
ISBN: 9811570922 ISBN-13(EAN): 9789811570926
Издательство: Springer
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Цена: 20733.00 р.
Наличие на складе: Нет в наличии.

Описание: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

Plasma Electronics

Автор: Makabe
Название: Plasma Electronics
ISBN: 1482222051 ISBN-13(EAN): 9781482222050
Издательство: Taylor&Francis
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Цена: 33686.00 р.
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Описание:

Beyond enabling new capabilities, plasma-based techniques, characterized by quantum radicals of feed gases, hold the potential to enhance and improve many processes and applications. Following in the tradition of its popular predecessor, Plasma Electronics, Second Edition: Applications in Microelectronic Device Fabrication explains the fundamental physics and numerical methods required to bring these technologies from the laboratory to the factory.

Emphasizing computational algorithms and techniques, this updated edition of a popular monograph supplies a complete and up-to-date picture of plasma physics, computational methods, applications, and processing techniques. Reflecting the growing importance of computer-aided approaches to plasma analysis and synthesis, it showcases recent advances in fabrication from micro- and nano-electronics, MEMS/NEMS, and the biological sciences.

A helpful resource for anyone learning about collisional plasma structure, function, and applications, this edition reflects the latest progress in the quantitative understanding of non-equilibrium low-temperature plasma, surface processing, and predictive modeling of the plasma and the process. Filled with new figures, tables, problems, and exercises, it includes a new chapter on the development of atmospheric-pressure plasma, in particular microcell plasma, with a discussion of its practical application to improve surface efficiency.

The book provides an up-to-date discussion of MEMS fabrication and phase transition between capacitive and inductive modes in an inductively coupled plasma. In addition to new sections on the phase transition between the capacitive and inductive modes in an ICP and MOS-transistor and MEMS fabrications, the book presents a new discussion of heat transfer and heating of the media and the reactor.

Integrating physics, numerical methods, and practical applications, this book equips you with the up-to-date understanding required to scale up lab breakthroughs into industrial innovations.

3D Microelectronic Packaging: From Fundamentals to Applications

Автор: Li Yan, Goyal Deepak
Название: 3D Microelectronic Packaging: From Fundamentals to Applications
ISBN: 3319830864 ISBN-13(EAN): 9783319830865
Издательство: Springer
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Цена: 21953.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.

Ise microelectronic circuit design

Автор: Jaeger, Richard Blalock, Travis
Название: Ise microelectronic circuit design
ISBN: 1260597857 ISBN-13(EAN): 9781260597851
Издательство: McGraw-Hill
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Цена: 10637.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: With varied activities - including sorting, matching and drawing - these workbooks help your learners practise what they have learnt. Focus, Practice and Challenge exercises provide clear progression through each topic, helping learners see what they`ve achieved. Ideal for use in the classroom or for homework. Links to `Language focus` boxes in the learner`s book provide more grammar practice.

Principles of semiconductor devices

Автор: Dimitrijev, Sima (, Professor, School Of Microelectronic Engineering At Griffith, Australia)
Название: Principles of semiconductor devices
ISBN: 0199896348 ISBN-13(EAN): 9780199896349
Издательство: Oxford Academ
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Цена: 40681.00 р.
Наличие на складе: Поставка под заказ.

Microelectronic circuits

Автор: Sedra, Adel S. (distinguished Professor Emeritus Of Electrical And Computer Engineering, Distinguished Professor Emeritus Of Electrical And Computer E
Название: Microelectronic circuits
ISBN: 0190853506 ISBN-13(EAN): 9780190853501
Издательство: Oxford Academ
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Цена: 24585.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: This Courseware package consist out of two publications, Agile Foundation Courseware - English and you are adviced to obtain the publication Agile for responsive organizations - A Pocket Guide. This courseware is for the Agile Foundation certification by the Agile Consortium, and follows the Certify to Inspire philosophy, enabling continuous learning and an adaptive mindset in an Agile world and corporate environment. This courseware has been reviewed by Agile Consortium board members and been accredited by Van Haren Learning Solutions.This Courseware provides a didactic journey in Agile, including teasers, energizers and many little assignments. There is also a reference to free online Agile literature and to the online Agile Foundation demo exam. The main modules of this exam are: o What is Agileo Agile Culture and Leadershipo Scrumo Methods and frameworkso Agile way of workingo Value and Continuous deliveryo Empiricism and improvementModules of this course ware:o What is Agileo Fundamental systems to Agile¢ XP¢ Crystal¢ Scrum¢ DSDMo Philosophizingo Scalingo Kanbano Lean StartupAbout the Agile Foundation CertificationThe Agile Foundation certificate is intended for those who are relatively new to the concept of "Agile" and would like to discover what it exactly entails.The idea behind this exam is that you are serious about delving into the Agility concept and related practices. How you decide to do that will be up to you. You can read books, articles, or blogs. You can also watch videos, listen to podcasts, attend events, or observe others who are working with Agile in practice. Or another possibility is to follow a course in Agile.The Agile Foundation Exam is an independent exam meaning it is not tied to a specific method. If you have the Agile Foundation certificate, you will have demonstrated you understand what Agile means and that you can identify the methods and concepts most commonly used in Agile organizations.

Silicon Nitride for Microelectronic Applications

Автор: J. T. Milek
Название: Silicon Nitride for Microelectronic Applications
ISBN: 1461596114 ISBN-13(EAN): 9781461596110
Издательство: Springer
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Цена: 6097.00 р.
Наличие на складе: Есть у поставщика Поставка под заказ.

Описание: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Diffusion Mask Applications . . . . . . . . . . . . `" 11 Glass-to-Metal Seals . 23 Passivation Applications . 24 Isolation . 76 Radiation Hardening Applications .

Defects in Microelectronic Materials and Devices

Название: Defects in Microelectronic Materials and Devices
ISBN: 0367386399 ISBN-13(EAN): 9780367386399
Издательство: Taylor&Francis
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Цена: 10717.00 р.
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Описание:

Uncover the Defects that Compromise Performance and Reliability
As microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them.





A comprehensive survey of defects that occur in silicon-based metal-oxide semiconductor field-effect transistor (MOSFET) technologies, this book also discusses flaws in linear bipolar technologies, silicon carbide-based devices, and gallium arsenide materials and devices. These defects can profoundly affect the yield, performance, long-term reliability, and radiation response of microelectronic devices and integrated circuits (ICs). Organizing the material to build understanding of the problems and provide a quick reference for scientists, engineers and technologists, this text reviews yield- and performance-limiting defects and impurities in the device silicon layer, in the gate insulator, and/or at the critical Si/SiO2 interface. It then examines defects that impact production yield and long-term reliability, including:









  • Vacancies, interstitials, and impurities (especially hydrogen)






  • Negative bias temperature instabilities






  • Defects in ultrathin oxides (SiO2 and silicon oxynitride)






Take A Proactive Approach
The authors condense decades of experience and perspectives of noted experimentalists and theorists to characterize defect properties and their impact on microelectronic devices. They identify the defects, offering solutions to avoid them and methods to detect them. These include the use of 3-D imaging, as well as electrical, analytical, computational, spectroscopic, and state-of-the-art microscopic methods. This book is a valuable look at challenges to come from emerging

Defects in Microelectronic Materials and Devices

Автор: Fleetwood, Daniel M.
Название: Defects in Microelectronic Materials and Devices
ISBN: 1420043765 ISBN-13(EAN): 9781420043761
Издательство: Taylor&Francis
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Цена: 30624.00 р.
Наличие на складе: Нет в наличии.

Microelectronic Circuit Design for Energy Harvesting Systems

Автор: Di Paolo Emilio Maurizio
Название: Microelectronic Circuit Design for Energy Harvesting Systems
ISBN: 3319837753 ISBN-13(EAN): 9783319837758
Издательство: Springer
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Цена: 10366.00 р.
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Описание: This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion.

Understanding delta-sigma data converters

Автор: Pavan, Shanthi Schreier, Richard (oregon State University) Temes, Gabor C. (university Of California, Los Angeles)
Название: Understanding delta-sigma data converters
ISBN: 1119258278 ISBN-13(EAN): 9781119258278
Издательство: Wiley
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Цена: 18050.00 р.
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Microelectronic Interconnections and Assembly

Автор: G.G. Harman; Pavel Mach
Название: Microelectronic Interconnections and Assembly
ISBN: 9401061599 ISBN-13(EAN): 9789401061599
Издательство: Springer
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Цена: 10610.00 р.
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Описание: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996


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