Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021),
Описание: Presents 65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.
Описание: Presents 58 papers covering Controls, Diagnostics, and Instrumentation, Cycle Innovations, Cycle Innovations: Energy Storage, and Education; and Electric Power.
Описание: Presents 51 papers covering Turbomachinery - Design Methods and CFD Modeling for Turbomachinery; and Ducts, Noise, and Component Interactions.
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