Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package, Krцhnert Steffen, Keser Beth
Описание: Advanced data management has always been at the core of efficient database and information systems. Recent trends like big data and cloud computing have aggravated the need for sophisticated and flexible data storage and processing solutions.This book provides a comprehensive coverage of the principles of data management developed in the last decades with a focus on data structures and query languages. It treats a wealth of different data models and surveys the foundations of structuring, processing, storing and querying data according these models. Starting off with the topic of database design, it further discusses weaknesses of the relational data model, and then proceeds to convey the basics of graph data, tree-structured XML data, key-value pairs and nested, semi-structured JSON data, columnar and record-oriented data as well as object-oriented data. The final chapters round the book off with an analysis of fragmentation, replication and consistency strategies for data management in distributed databases as well as recommendations for handling polyglot persistence in multi-model databases and multi-database architectures. While primarily geared towards students of Master-level courses in Computer Science and related areas, this book may also be of benefit to practitioners looking for a reference book on data modeling and query processing. It provides both theoretical depth and a concise treatment of open source technologies currently on the market.
Автор: Shichun Qu; Yong Liu Название: Wafer-Level Chip-Scale Packaging ISBN: 149391555X ISBN-13(EAN): 9781493915552 Издательство: Springer Рейтинг: Цена: 17074.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
Автор: Lau Название: Fan-Out Wafer-Level Packaging ISBN: 9811088837 ISBN-13(EAN): 9789811088834 Издательство: Springer Рейтинг: Цена: 12196.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Название: Contemporary High Performance Computing ISBN: 1138487074 ISBN-13(EAN): 9781138487079 Издательство: Taylor&Francis Рейтинг: Цена: 20671.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on the ecosystems surrounding the world`s leading centers for high performance computing (HPC). This third volume will be a continuation of the two previous volumes, and will include other HPC ecosystems using the same chapter outline: description of a flagship system, major application workloads, facilities, and sponsors.
Описание: The Handbook of Multimodal-Multisensor Interfaces provides the first authoritative resource on what has become the dominant paradigm for new computer interfaces: user input involving new media (speech, multi-touch, hand and body gestures, facial expressions, writing) embedded in multimodal-multisensor interfaces that often include biosignals. This edited collection is written by international experts and pioneers in the field. It provides a textbook, reference, and technology roadmap for professionals working in this and related areas. This second volume of the handbook begins with multimodal signal processing, architectures, and machine learning. It includes recent deep learning approaches for processing multisensorial and multimodal user data and interaction, as well as context-sensitivity. A further highlight is processing of information about users' states and traits, an exciting emerging capability in next-generation user interfaces. These chapters discuss real-time multimodal analysis of emotion and social signals from various modalities, and perception of affective expression by users. Further chapters discuss multimodal processing of cognitive state using behavioral and physiological signals to detect cognitive load, domain expertise, deception, and depression. This collection of chapters provides walk-through examples of system design and processing, information on tools and practical resources for developing and evaluating new systems, and terminology and tutorial support for mastering this rapidly expanding field. In the final section of this volume, experts exchange views on the timely and controversial challenge topic of multimodal deep learning. The discussion focuses on how multimodal-multisensor interfaces are most likely to advance human performance during the next decade.
Автор: Siddhartha Bhattacharyya Название: Quantum-Inspired Intelligent Systems for Multimedia Data Analysis ISBN: 1522552197 ISBN-13(EAN): 9781522552192 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 27027.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As multimedia data advances in technology and becomes more complex, the hybridization of soft computing tools allows for more robust and safe solutions in data processing and analysis.Quantum-Inspired Intelligent Systems for Multimedia Data Analysis provides emerging research on techniques used in multimedia information processing using intelligent paradigms including swarm intelligence, neural networks, and deep learning. While highlighting topics such as clustering techniques, neural network architecture, and text data processing, this publication explores the methods and applications of computational intelligent tools. This book is an important resource for academics, computer engineers, IT professionals, students, and researchers seeking current research in the field of multimedia data processing and quantum intelligent systems.
Описание: The Handbook of Multimodal-Multisensor Interfaces provides the first authoritative resource on what has become the dominant paradigm for new computer interfaces: user input involving new media (speech, multi-touch, hand and body gestures, facial expressions, writing) embedded in multimodal-multisensor interfaces that often include biosignals. This edited collection is written by international experts and pioneers in the field. It provides a textbook, reference, and technology roadmap for professionals working in this and related areas. This second volume of the handbook begins with multimodal signal processing, architectures, and machine learning. It includes recent deep learning approaches for processing multisensorial and multimodal user data and interaction, as well as context-sensitivity. A further highlight is processing of information about users' states and traits, an exciting emerging capability in next-generation user interfaces. These chapters discuss real-time multimodal analysis of emotion and social signals from various modalities, and perception of affective expression by users. Further chapters discuss multimodal processing of cognitive state using behavioral and physiological signals to detect cognitive load, domain expertise, deception, and depression. This collection of chapters provides walk-through examples of system design and processing, information on tools and practical resources for developing and evaluating new systems, and terminology and tutorial support for mastering this rapidly expanding field. In the final section of this volume, experts exchange views on the timely and controversial challenge topic of multimodal deep learning. The discussion focuses on how multimodal-multisensor interfaces are most likely to advance human performance during the next decade.
Описание: Cyber-attacks are rapidly becoming one of the most prevalent issues globally, and as they continue to escalate, it is imperative to explore new approaches and technologies that help ensure the security of the online community. Beyond cyber-attacks, personal information is now routinely and exclusively housed in cloud-based systems. The rising use of information technologies requires stronger information security and system procedures to reduce the risk of information breaches.Advanced Methodologies and Technologies in System Security, Information Privacy, and Forensics presents emerging research and methods on preventing information breaches and further securing system networks. While highlighting the rising concerns in information privacy and system security, this book explores the cutting-edge methods combatting digital risks and cyber threats. This book is an important resource for information technology professionals, cybercrime researchers, network analysts, government agencies, business professionals, academicians, and practitioners seeking the most up-to-date information and methodologies on cybercrime, digital terrorism, network security, and information technology ethics.
Автор: Maki Habib Название: Advanced Online Education and Training Technologies ISBN: 1522570101 ISBN-13(EAN): 9781522570103 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 27027.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Technology plays a vital role in bridging the digital divide and enhancing student learning both in and outside of the classroom. This is possible thanks to the successful use of educational online technologies and other new teaching resources being integrated into learning environments.Advanced Online Education and Training Technologies is an essential reference source that explores student and teacher learning through various online platforms. Featuring research on topics such as professional development in the twenty-first century and cultural differences in online learning environments, this book is ideally designed for educators, students, academicians, and other education professionals seeking coverage on enhanced student learning through technology-based learning tools.
Автор: Leando Soares Indrusiak, Piotr Dziurzanski, Amit Kumar Singh Название: Dynamic Resource Allocation in Embedded, High-Performance and Cloud Computing ISBN: 8793519087 ISBN-13(EAN): 9788793519084 Издательство: Taylor&Francis Рейтинг: Цена: 11023.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Covers dynamic resource allocation heuristics for many core systems. It addresses different types of systems, aiming to harmonise the approaches to dynamic allocation across the complete spectrum between systems with little flexibility and strict real-time guarantees all the way to highly dynamic systems with soft performance requirements.
Автор: Petr N. Vabishchevich Название: Computational Technologies: Advanced Topics ISBN: 3110359944 ISBN-13(EAN): 9783110359947 Издательство: Walter de Gruyter Цена: 9288.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book discusses questions of numerical solutions of applied problems on parallel computing systems. Nowadays, engineering and scientific computations are carried out on parallel computing systems, which provide parallel data processing on a few computing nodes. In the development of up-to-date applied software, this feature of computers must be taken into account for the maximum efficient usage of their resources. In constructing computational algorithms, we should separate relatively independent subproblems in order to solve them on a single computing node.
Автор: Keser Название: Embedded and Fan-Out Wafer Level Packaging Technol ogies ISBN: 1119314135 ISBN-13(EAN): 9781119314134 Издательство: Wiley Рейтинг: Цена: 18525.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges
Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.
Filled with contributions from some of the field's leading experts, Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions.
Discusses specific company standards and their development results
Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
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