Metal-Dielectric Interfaces in Gigascale Electronics: Thermal and Electrical Stability, He Ming, Lu Toh-Ming
Автор: Borja Название: Dielectric Breakdown in Gigascale Electronics ISBN: 3319432184 ISBN-13(EAN): 9783319432182 Издательство: Springer Рейтинг: Цена: 6839.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. Similarly, the models presented here will help to improve current methodologies for estimating the failure of gigascale electronics at device operating conditions from accelerated lab test conditions. Numerous graphs, tables, and illustrations are included to facilitate understanding of the topics. Readers will be able to understand dielectric breakdown in thin films along with the main failure modes and characterization techniques. In addition, they will gain expertise on conventional as well as new field acceleration test models for predicting long term dielectric degradation.
Автор: Jeffrey A. Davis; James D. Meindl Название: Interconnect Technology and Design for Gigascale Integration ISBN: 1461350883 ISBN-13(EAN): 9781461350880 Издательство: Springer Рейтинг: Цена: 18294.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM`s revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
A guide to the applications of holographic techniques for microwave and millimeter wave imaging
Real-Time Three-Dimensional Imaging of Dielectric Bodies Using Microwave/Millimeter Wave Holography offers an authoritative guide to the field of microwave holography for the specific application of imaging dielectric bodies. The authors--noted experts on the topic--review the early works in the area of optical and microwave holographic imaging and explore recent advances of the microwave and millimeter wave imaging techniques. These techniques are based on the measurement of both magnitude and phase over an aperture and then implementing digital image reconstruction.
The book presents developments in the microwave holographic techniques for near-field imaging applications such as biomedical imaging and non-destructive testing of materials. The authors also examine novel holographic techniques to gain super-resolution or quantitative images. The book also includes a discussion of the capabilities and limitations of holographic reconstruction techniques and provides recommendations for overcoming many of the limitations. This important book:
- Describes the evolution of wide-band microwave holography techniques from synthetic aperture radar principles
- Explores two major approaches to near-field microwave holography: Using the incident field and Green's function information and using point-spread function of the imaging system
- Introduces the "diffraction limit" in the resolution for techniques that are based on the Born approximation, and provides techniques to overcome this limit
Written for students and research associates in microwave and millimeter wave engineering, Real-Time Three-Dimensional Imaging of Dielectric Bodies Using Microwave/Millimeter Wave Holography reviews microwave and millimeter-wave imaging techniques based on the holographic principles and provides information on the most current developments.
Автор: J.M. Goldschvartz; A.K. Niessen; W. Boone Название: Conduction and breakdown in dielectric liquids ISBN: 9029803002 ISBN-13(EAN): 9789029803007 Издательство: Springer Рейтинг: Цена: 13677.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The aim of the 5th international conference on conduction and breakdown of dielectric liquids is the same as that of the preceding conferences, namely to have a forum where all experts in this vast field can meet, can present their latest results and can exchange their ideas.
Автор: Grigoriy I. Torgovnikov Название: Dielectric Properties of Wood and Wood-Based Materials ISBN: 3642774555 ISBN-13(EAN): 9783642774553 Издательство: Springer Рейтинг: Цена: 13677.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Provided here is a comprehensive treatise on all aspects ofdielectric properties of wood and wood products. - Measurement of dielectric parameters ofwood.- Dielectric properties of oven-dry wood. - Effect of different kinds oftreatment on dielectric properties of wood.
Автор: Paluch Marian Название: Dielectric Properties of Ionic Liquids ISBN: 331981298X ISBN-13(EAN): 9783319812984 Издательство: Springer Рейтинг: Цена: 12196.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book discusses the mechanisms of electric conductivity in various ionic liquid systems (protic, aprotic as well as polymerized ionic liquids).
Автор: S.O. Gladkov Название: Dielectric Properties of Porous Media ISBN: 3642055214 ISBN-13(EAN): 9783642055218 Издательство: Springer Рейтинг: Цена: 18904.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This monograph systematically presents the fundamentals of theoretical and experimental research into the most important physical characteristics of porous structures. Non-standard behavior of certain physical parameters, such as the breakdown of the electric field of porous substances, is described.
Описание: Advances in synthesis and characterization of dielectric, piezoelectric and ferroelectric thin films are included in this volume. Dielectric, piezoelectric and ferroelectric thin films have a tremendous impact on a variety of commercial and military systems including tunable microwave devices, memories, MEMS devices, actuators and sensors.
Автор: J. Keith Nelson Название: Dielectric Polymer Nanocomposites ISBN: 1441915907 ISBN-13(EAN): 9781441915900 Издательство: Springer Рейтинг: Цена: 22797.00 р. Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book discusses the background, principles and promise of nanodielectrics then details the processing of nanocomposites. It also addresses special considerations of clay-based processes and concludes with the perspective of industrial applications.
Описание: As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects.
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