Jain Pushkar; Eugene J. Rymaszewski Thin-Film Capacitors for Packaged Electronics 9781461348085

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Автор: Jain Pushkar; Eugene J. Rymaszewski
Название: Thin-Film Capacitors for Packaged Electronics
ISBN: 9781461348085
Издательство: Springer
Классификация: ISBN-10: 1461348080
Обложка/Формат: Soft cover
Страницы: 158
Вес: 0.26 кг.
Дата издания: 23.02.2014
Язык: English
Размер: 234 x 156 x 10
Читательская аудитория: Science
Основная тема: Manufacturing, Machines, Tools
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: Capacitors were invented in 1745 and have served as portable electrical charge storage devices ever since. During the 19th century a general understanding of electro-magnetism was gradually developed. Electronic devices and circuits were pioneered in the early 20th century and, by its end, revolutionized the generation, processing, storage and transmission of information. No evolutionary limits have yet been approached.
Strictly speaking, all circuits have capacitors; often not wanted, considered parasitic capacitors, such as capacitance of signal interconnections. A great deal of effort in academia and industry attempts to reduce the value of the parasitic capacitors by means of novel materials and structures with the lowest dielectric constant. Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of whats the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:

-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.

Thin-Film Capacitors for Packaged Electronics, Jain Pushkar; Eugene J. Rymaszewski